With the rise of multi-chiplet packages from companies such as AMD & Apple, there are challenges shown from current PHY technologies such as cost, reach, yields, etc, as explained about NuLink in the link below (no pun intended). Eliyan's tech solves this by ridding the need for interposers which solves multiple issues with current PHY technologies but then solves the low bandwidth drawback with NuLink connecters between each chiplet. This may also benefit single-chiplet packages with the... Read more Weiterlesen...
